Thermal Conductive Adhesive – 5g Heatsink Silicone Glue for CPU, GPU, LED & Electronics

Thermal Conductive Adhesive – 5g Heatsink Silicone Glue for CPU, GPU, LED & Electronics

Achieve reliable, high-performance thermal bonding with this 5g thermal conductive adhesive. A one-component, room-temperature vulcanizing silicone compound, this adhesive delivers excellent thermal conductivity, strong adhesion, and wide temperature resistance — making it ideal for CPU/GPU heatsinks, LED assemblies, power transistors, and a wide range of electronic components.

Key Features

• High Thermal Conductivity: 0.671 W/m-K thermal conductivity efficiently transfers heat away from sensitive components.
• Fast Setting: Sets in just 3 minutes at 25°C for quick assembly and reduced downtime.
• Wide Temperature Range: Operates reliably from -60°C to 200°C, with short-term resistance up to 300°C.
• Strong Bonding: 25 kg bonding strength ensures components stay firmly in place.
• Electrically Insulating: Insulation factor of 5.1 — safe for use around sensitive electronic circuits.
• Vacuum Packaged: Independent vacuum packaging prevents oxidation and drying, extending shelf life.
• Solvent-Free Formula: Safe for use in electronics, electrical appliances, instrumentation, and LED applications.

Applications

• CPU and GPU heatsink gap filling and thermal bonding
• LED and heatsink adhesion
• High-power transistor and aluminum gap filling
• Silicon-controlled element and diode contact filling
• General electronic component heat dissipation and insulation

How to Use

1. Clean the bonding surface thoroughly with alcohol or a suitable solvent. Do not use detergent.
2. Allow the surface to dry completely before application.
3. Squeeze out the required amount and apply evenly to the surface. Recommended coating thickness: 0.1–0.5mm (thinner is better).
4. Press components together immediately after application.
5. Replace cap immediately after use to prevent drying.

Technical Specifications

• Net Weight: 5g per piece
• Thermal Conductivity: 0.671 W/m-K
• Thermal Impedance: 0.06
• Setting Time: 3 min at 25°C
• Bonding Strength: 25 kg
• Operating Temperature: -60°C to 200°C (short-term: 300°C)
• Insulation Factor: 5.1
• Dissipation Coefficient: 0.005
• Packaging: Vacuum sealed for freshness

What’s Included

• 1 × Thermal Conductive Adhesive (5g, vacuum packed)

Looking for more electronics components and accessories? Browse our Electronics Accessories Collection or visit Tom’s Hardware’s thermal compound guide for expert tips on choosing and applying thermal compounds.

Disclaimer: This product is an industrial adhesive and thermal compound intended for electronics and electrical applications. It is not intended for medical use, and is not intended to diagnose, treat, cure, or prevent any disease or health condition. Use in a well-ventilated area. Avoid contact with eyes and skin. Keep out of reach of children. Follow all application instructions carefully.