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MaAnt Desoldering Wick Braided Copper Wire PCB BGA Repair

MaAnt Desoldering Wick Braided Copper Wire PCB BGA Repair

Regular price $31.26 USD
Regular price $31.23 USD Sale price $31.26 USD
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Keep your phone, PCB, and BGA soldering work clean and precise with the MaAnt Low-Residue Desoldering Wick. Made from high-quality braided copper wire pre-treated with RMA solder flux, this wash-free desoldering braid absorbs excess solder quickly and efficiently — leaving minimal residue behind for a clean finish every time.

Available in six widths (1.0 mm to 3.5 mm) and 1.5 m length per roll, these desoldering wicks are ideal for professional phone technicians, electronics hobbyists, and PCB rework specialists.

Made in Mainland China.

Key Features

  • Six size options: 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, and 3.5 mm widths — choose the right wick for the job
  • 1.5 m length per roll for extended use and value
  • Braided copper construction for fast, effective solder absorption
  • RMA flux pre-applied — wash-free formula means less cleanup after rework
  • Low-residue performance — keeps PCB pads and component leads clean
  • Versatile use: compatible with mobile phone repairs, BGA rework, PCB assembly, and general electronics soldering projects
  • No high-concern chemicals in materials

Model Options

  • MY-1015 — Width: 1.0 mm | Length: 1.5 m
  • MY-1515 — Width: 1.5 mm | Length: 1.5 m
  • MY-2015 — Width: 2.0 mm | Length: 1.5 m
  • MY-2515 — Width: 2.5 mm | Length: 1.5 m
  • MY-3015 — Width: 3.0 mm | Length: 1.5 m
  • MY-3515 — Width: 3.5 mm | Length: 1.5 m

How to Use

  1. Place the desoldering wick directly over the solder to be removed.
  2. Press the heated soldering iron tip onto the wick — solder will be absorbed into the braid.
  3. Lift and remove the wick once the solder has been absorbed.
  4. Cut off the used section of the wick with nippers before reusing.
  5. Repeat as needed until all excess solder is fully removed.

Safety Warnings

  • Only handle the grip and packaging portion of the wick during use — the active area becomes very hot.
  • Do not force the iron tip against the wick; apply gentle, steady pressure to protect components and the PCB.
  • Do not apply heat to the wick for more than 5 seconds at a time to prevent component or board damage.

Specifications

Material Braided Copper Wire
Flux Type RMA (Wash-Free)
Widths Available 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm
Length 1.5 m per roll
Application PCB, BGA, Mobile Phone Repair, Electronics Rework
Package 1× MaAnt Low-Residue Desoldering Wick (your chosen size)
Origin Mainland China

Package Includes

  • 1 × MaAnt Low-Residue Desoldering Wick (selected width, 1.5 m)

For more electronics safety and soldering best practices, visit the OSHA Soldering Safety Guidelines.

Browse more tools for your electronics workbench in our store:

Frequently Asked Questions

Q: What sizes of MaAnt desoldering wick are available?

A: The MaAnt desoldering wick comes in six widths — 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, and 3.5 mm — all at a standard length of 1.5 m per roll. Choose the width that best matches the solder pads or components you are working on.

Q: Is the MaAnt desoldering wick wash-free?

A: Yes. The MaAnt braided copper desoldering wick is pre-treated with RMA (Rosin Mildly Activated) flux, making it a wash-free formulation. It leaves very low residue after use, so you typically do not need to clean the PCB after desoldering.

Q: What applications is this desoldering wick suitable for?

A: This desoldering wick is well-suited for mobile phone PCB repair, BGA chip rework, general electronics assembly and rework, computer motherboard repairs, and any project where precise and clean solder removal from circuit boards is required.

Q: How do I choose the right wick width for my project?

A: As a general rule, select a wick width that is equal to or slightly smaller than the solder joint or pad you want to clean. The 1.0 mm–1.5 mm widths work well for fine-pitch SMD components, while the 2.5 mm–3.5 mm widths are better suited for larger pads, through-hole joints, or BGA rework.

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